Effects on Academia
The setup principle of this center is to serve the academy. After its change into legal entity, it still keeps its original principle of serving the academy; however, in order to enhance our role as a bridge between academy and industry but without the reduction of service quality to the academy, we will appropriately increase our contact and service to the industry so as to further increase the effectiveness of “Enhance design technology and incubate design human resource”; we have strong progress in both the quality and quantity of the service we provide to Taiwan’s academy.
1. Setting Up Research Environment for IC Chip System Design
The center, in the setup of research environment for IC chip system design, has provided four services, for example, service for the application of design and verification environment, consultation service for the design verification measurement technology, back end verification service and digital and Mixed-signal chip test service. To general academic chip and system design R&D process, the first one that is going to be used is the application service of design verification environment. Teachers or students, based on their research fields, can select necessary software and hardware, device database, silicon intellectual property and design verification work flow and platform to perform the application. Next, during the utilization of related design verification environment, if any trouble is met, design verification measurement technology consultation service will be used, and the rich experiences of chip implementation center will be used to assist the continuation of the research. Back end verification service can provide the necessary verification procedures before the chip is put into production. After the completion of production of digital and mixed chip, it is necessary to use digital and mixed signal chip test service to confirm if chip function and spec can meet the expectation. Therefore, to the R&D of the academy, the service provided by the center has absolute influence and is indispensable.
In addition to the above four services, the R&D of MP-SoC in the center also includes the services to the academy. Through this integrated project, the participating colleges and universities can perform SoC related R&D under limited budget. MP-SoC II project in 2007 is an integration of 11 SoC projects from the schools, if the same budge is used but the MP-SoC model is not adopted, then only three SoC projects can be performed. In the future, our center is going to plan regular MP-SoC service so as to increase the academic R&D capacity continuously.
2. Providing the Implementation and Test Service for IC Chip Design Prototype
a.Providing 90nm CMOS advanced process and continuously provide nine process services such as 0.13µm/
0.18µm/0.35µm CMOS, GaAs, CMOS MEMS, etc.
b.Helping teachers and students for the preparation of 1721 advanced and educational chips (It is 1552
chips in 2006) with a growth rate of 10.9%.
c.Involving in the cooperative development of CMOS MEMS/RF MEMS process. We also provide production
service for 0.18/0.35µm CMOS MEMS, with production quantity of 112 cases as compared to 92 cases in
the last year, which shows a growth of 21.7%.
d.Completed SiP technical related verification for Flip Chip.
e.SSA measurement and 67GHz 2-port S-parameters &50GHz 4-port S-parameters measurement services
are open to the academy.
f.In 2007, Hsinchu measurement and test lab has provided 613 cases of chip measurement services,
measurement and test lab of Southern Taiwan Science Park has provided 415 cases of chip measurement
services, that is, a total of 1028 cases.
3. Technical Exchange and Result Promotion
a.Providing 44 advanced RF IC, SoC and e-Learning training courses with 184 sessions; the total person-
time attending the course is 8441, and the head counts of students trained is about 2000, which is
remained the same.
b.Co-holding IC/SIP competitions with a participation of 601 teams/89 teams.
c.In 2007, our center has published 9 international journal papers, 10 international meeting papers, which
are all published in top international journals and seminars. All the journals we submitted are of SCI EI
or IEEE grades.
d.We assist the academy to publish chip production derived paper/patent/technical transfer for about
480 papers/cases.
e.International cooperation: We cooperate with CRC of Canada to perform Wireless Sensor Network
cooperative project that is applied in biomedical and environmental sensing; meanwhile, we also invite the
researchers to perform technical exchange, and we also send personnel to Canada to perform short-term
co-study on the RF circuit system design.
In addition, we also cooperate with Technical University of Denmark to perform Bio-MEMS platform cooperative project.
|
AboutUs
