Chip Implementation Services

　　For chip implementation in 2007, CIC continuously provided several well-developed IC fabrication processes supported by local foundries. Moreover, CIC released and initiated regular shuttle-runs using the TSMC 0.13?m MS/Logic CMOS advanced process. Eight technologies were available, including TSMC 0.13?m 1P8M RF/MS CMOS with four runs/year, TSMC 0.13?m 1P8M MS/Logic CMOS with four runs/year, TSMC 0.18?m 1P6M CMOS with five runs/year, UMC 0.18?m 1P6M CMOS with two runs/year, TSMC 0.35?m 2P4M CMOS with five runs/year, 0.35?m CMOS MEMS with five runs/year, TSMC 0.35?m 3P3M SiGe BiCMOS with four runs/year, and WIN 0.15?m pHEMT with two runs/year. Table 11 lists the future advanced process roadmap provided by CIC.