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Contributions on Major National Programs
This center, starting from 2002, has participated national technological project for chip system so as to set up all the infrastructure needed for the development of chip system design; until now, 2007 annual project has shown great help to the silicon-guiding project and SoC national project, with the related contribution as in the following. The digital, analog, RF, MEMS, SoC/IP design related technologies developed by CIC and the supply of SoC Platform has been proven to provide great help to the academy from chip and system design to the development of practical IP; the researchers can combine their own application design with the Platform provided by CIC so as to accelerate the design of SoC, hence, the academic R&D capability and the quality and quantity of the R&D result can be greatly enhanced.
1. In Chip and System Design and Verification Environment Aspect:
Complete chip and system design and verification environment is an indispensable element to the implementation of major national projects related to chip and system. Since the foundation of the center, it has cooperated with many famous domestic and foreign suppliers to introduce multiple chip and system design and verification software, device database and silicon intellectual property. In the mean time, it has developed or introduced related technologies aiming at different design demands and integrated them into complete chip and system design and verification environment to be used by the academy. The design and verification environment after integration, in addition to including the introduced software and hardware, device database and silicon intellectual property, also includes the design and verification work flow and platform developed by the center. Currently, in the design and verification work flow, the center can provide Full Custom, Cell-Based, Mixed-Signal and FPGA, etc. to the academy. In the design and verification platform aspect, it includes multiple projects single chip design and verification platform, Electronic System Level (ESL) virtual verification platform, back end verification platform and embedded system development platform. All the above work flow and platform can satisfy most of the current R&D demands in the academy; in the future, this center is going to continue to reinforce and update itself based on the academic demand and industrial development so as to maintain the novelty and practicability of the work flow and platform. For the above work flow and platform, our center also provides free technological consultation and teaching training to the academy to further assist the R&D work in the academy.
Since the center can provide perfect chip and system design and verification environment for the academy during the implementation of major national chip and system related technological project, that is, the academy does not need to assign budget for set up related research environment. In another aspect, it can also reduce the assignment of human resource for the development of related research environment. It is estimated conservatively that it can save each year about one billion NT dollars for the academy in purchasing software and hardware, device database, and silicon intellectual property as well as the human resource budget for in developing research environment (Calculation is based on commercial version price and general design service price adopted in the industry).
2. In Chip Process Aspect:
Advanced UMC 90nm CMOS process has been introduced so that high efficiency and high integration design such as RF SoC can be realized. In addition, “multiple projects chip” integration has been performed to provide free chip preparation service to the academy (including 9 processes); in 2007, this center has helped teachers and students in many schools to complete about 1721 chips, and a total of about 480 papers are to be published; furthermore this center has its great contribution in silicon-guided plan for incubating professors in related fields; meanwhile, the budget saved annually for the preparation of chip and system prototype is about several hundreds of millions NT dollars.
3. In Instrument and Equipment Aspect:
The SoC test machine purchased for SoC national technological project has been released for use since 2005. In 2006, the SoC chip test function and service quality has been greatly enhanced.
For heterogeneously integrated chip, CIC has provided MEMS dynamic and static measurement, 20GHz RFIC measurement and add new signal source analysis and 67GHz S-parameter measurement, which can greatly improve the measurement need of high level chip. It is estimated that about 650 chips measurement quantity can be reached.
For the measurement capacity in southern Taiwan, in 2007, complete RF and automatic high level analog measurement environment has been gradually expanded, the measurement service frequency is thus increased from 207 times in 2006 to 400 times in 2007. This is very helpful to the R&D capacity in southern Taiwan.
Meanwhile, the setup chip and system test equipment shared environment can save a lot of test environment setup budget for the academy; in addition, this center has also provided equipment share and technological consultation, which can also save each year a lot of test environment maintenance and update fee for the academy.
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