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Chip CenterDSDIntroduction to DSD

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  With the advent of high-performance and high-density IC design, the demands of highly reliable Electronic Design Automation (EDA) environment and service significantly increase in the 21st century. That is to say, acquiring and utilizing suitable EDA tools becomes a key trend to devise innovative System-on-a-Chip (SoC)/Intellectual Property (IP) designs. Thus, the birth of Design Service Division (DSD) is welcomed to meet this urgent demand. DSD, which was founded in 1992, is one of the most important division in Chip Implementation Center (CIC) of National Science Council in Taiwan. In this division, there are more than 20 staffs, where 2 members own Ph. D. degree, 16 members own Master degree, and others own Bachelor degree, all in Electrical Engineering and Computer Science (EECS) fields. The major tasks of this division focus on setting up EDA design flows, supplying EDA tools as well as cell libraries for academic/educational institutes, technology consultation, and SoC/IP research. It is well known that there exist several kinds design flows for various aspects application of 3C (Computer, Communication and Consumer), such as Cell-Based, DFT (Design for Testability), Full-Custom, Mixed-Signal, RF-MMIC (Monolithic Microwave Integrated Circuits), and FPGA design flows. Choosing the different design flows will alter performing EDA tools. Therefore, promoting these design flows, EDA tools and cell libraries to academic/educational institutes are our critical tasks. Recently, the innovative IP and SoC designs attract many practical DSP (Digital Signal Processing) and communication applications; hence SoC/IP design methodology research becomes a new undertaking in CIC. Due to our successive efforts, many excellent results including chip design service and international publications are honored.

  This chapter is organized as follows: In the Section I, we make a detailed description of DSD design environment. Reputable design services of DSD among academic/educational institutes are mentioned in the Section II. At last, in the Section III, brief statements summarize and point out the presentation of this chapter and future works, respectively.