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Preface:
Though cooperating with foreign organizations is another way to acquire advanced technology, well-built relationship must be done first. In 2001, CIC had good connections with IMEC, IDEC, VDEC, STARC, and SoC Design Center in KSRP. Through exchange visit activities, more information about these foreign organizations were gathered and they did make a great impact on our future plan.
Annual report:
Please double click here to get 2011 Annual Report.
Lastest News:
On March 7th, Prof. Tam Kam Weng and Prof. Alfred Wong, University of Macau, accompanied by Prof. Tai
-Ping Sun, visited CIC to discuss the chip implementation service and training program. Prof. Tzi-Dar Chiueh,
Director of Chip Implement Center, introduced CIC operation mode, service items and the direction of future
development. Prof. Tzi-Dar Chiueh recommended that the University of Macau may cooperate with Taiwan
academic and engage in research exchange activities.
On March 6th the Japanese workshop delegation, including professors and students from Kyoto University,
Osaka University, Hokkaido University, visited CIC and accompanied by prof. Albert Chin. The purpose of the
visit is to understand CIC development in IC design.
On January 25th, Prof. Lina Sarro, Delft University of Technology in the Netherlands,accompanied by
Prof.Weileun Fang, visited CIC. Prof. Sarro encouraged Taiwan students to study in Europe and engage
in research exchange activities. She expressed the hope that Taiwan and the Netherlands may conduct
academic exchanges through joint seminars.
Prof. Euisik Yoon and Prof. Katsuo Kurabayashi, University of Michigan, visited CIC on January 22nd
and accompanied by Prof. Yu-Ting Cheng. The purpose of the visit is to understand CIC development in
the field of micro-electromechanical and the training practices for MEMS design engineers. Prof.Yu-
Ting Cheng, the vice executive of National Program on Nano Technology (NPNT), said Taiwan academic
can cooperate with world-renowned scholars, and Chip Implementation Center might be the platform
for cooperation and might develop the key technologies for MEMS development.
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TPD
